www.centralsemi.com r0 (27-march 2013) package details tlm364 case mechanical drawing mounting pad geometry (dimensions in mm) part marking: 7-8 character alpha/numeric code lead code: reference individual device datasheet.
www.centralsemi.com r0 (27-march 2013) package details tlm364 case tape dimensions and orientation (dimensions in mm) tape width: 12mm devices are taped in accordance with electronic industries association standard eia-481-d direction of unreeling reel labeling information each reel is labeled with the following information: central part number, customer part number, purchase order number, quantity, lot number, date code, ship date and marking code. packaging base 13 reel = 5,000 pcs. reel packing information ordering information ? for devices taped and reeled on 13 reels, add tr13 suffix to part number. ? all smds are available in small quantities for prototype and manual placement applications. reel size reels per box (maximum) parts per box (maximum) box dimensions shipping weight (max.) inch cm lb kg 13 5 14 26 25,000 70,000 130,000 15x4x15 15x15x9 15x15x18 38x10x38 38x38x23 38x38x46 12 32 57 6 15 26
material composition specification tlm364 case device average mass . . . . . . . . . . . . . . . . . . . . 92 mg fluctuation margin . . . . . . . . . . . . . . . . . . . . . . +/-10% www.centralsemi.com r0 (11-january 2012) component material material substance cas no. substance (%wt) (mg) (%wt) (mg) (ppm) active device doped si 10.41% 9.58 si 7440-21-3 10.41% 9.58 104,130 clip cu alloy 5.36% 4.93 cu 7440-50-8 5.21% 4.79 52,065 fe 7439-89-6 0.15% 0.14 1,522 leadframe cu alloy 32.72% 30.1 cu 7440-50-8 32.66% 30.05 326,630 fe 7439-89-6 0.05% 0.05 543 die attach high temperature solder paste 4.52% 4.16 pb 7439-92-1 4.18% 3.85 41,848 sn 7440-31-5 0.23% 0.21 2,283 ag 7440-22-4 0.11% 0.1 1,087 encapsulation* emc green 46.98% 43.22 silica 60676-86-0 36.17% 33.28 361,739 epoxy resin 29690-82-2 4.70% 4.32 46,957 phenol resin 9003-35-4 4.55% 4.19 45,543 carbon black 1333-86-4 0.14% 0.13 1,413 metal hydroxide 1309-42-8 1.41% 1.3 14,130 plating matte tin 0.01% 0.01 sn 7440-31-5 0.01% 0.01 109 *emc green molding compound is halogen free. disclaimer the information provided in this material composition data sheet is, to the best of our knowledge, correct. however, there is n o guarantee to completeness or accuracy, as some information is derived from data sources outside the company.
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